3D Apple A6 CPU tipped amid iPhone 5 overheat reports

Apple’s A6 processor could beat Intel to the market for 3D IC chip construction, using the complex layering system so as to avoid overheating issues of the sort supposedly threatening to delay the next-gen iPhone and the current Apple A5 processor. According to EETimes, a Taiwanese report claims TSMC will be producing 3D 28nm chips [...]

Source: http://feeds.slashgear.com/~r/slashgear/~3/rJz7eMHQvXg/

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